Reed
Well-known Member
I started recapping my Sansui QRX 6001 last night. To my surprise, when I applied heat to pull the old caps off the PCBs, some of the areas on the PCBs where the solder attached the cap to the board actually separated from the surface of the PCB. Solder will not stick to the area vacated by these soldering "rings." Fortunately I have been able to bend the legs of the caps over to the next component in the circuit and complete the circuit that way, but why are the PCB soldering areas coming of the board?
I am using a Radio Shack soldering station that has "low (20 watt)" and "high (40 watt)" settings. I am using the "high" 40 watt setting. Am I using too much heat? Or are these 35 year ld PCBs just beyond their service life and disintegrating due to age?
Any tips are appreciated.
I am using a Radio Shack soldering station that has "low (20 watt)" and "high (40 watt)" settings. I am using the "high" 40 watt setting. Am I using too much heat? Or are these 35 year ld PCBs just beyond their service life and disintegrating due to age?
Any tips are appreciated.